Co-Packaged Optics Markets 2021-2025

Published October 6, 2020

Description

Co-packaged optics markets are is an increasingly attracting technology supporting high-speed optical networks, high-performance computing and storage applications by bringing photonics devices and electronic switching together in a single package to reduce power consumption and thermal effects, while at the same time reducing footprints.

This report provides CIR’s assessment and five-year forecast of the new revenue opportunities created by co-packaged optics with special focus on transceivers for data centers for 400G, 800G and Terabit connectivity. The report also provides coverage of critical components in the co-packaged optics including novel light sources, substrate materials, etc. We also discuss the various options for fitting the latest ASICs and transceivers into a single package.

The report also contains a review of the organizations that are shaping the co-packaged optics sector including the Co-Packaged Collaboration, OIF and EPIC

Table of Contents

Executive Summary

Chapter One Introduction
1.1 Background to this report
1.2 Goal and scope of this report
1.3 Methodology of this report
1.4 Plan of this report

Chapter Two Technology Assessment
2.1 The co-packaging concept: Why we need it
2.1.1 SERDES simplification
2.1.2 Power consumption and thermal optimization
2.1.3 Device density
2.1.4 Technical challenges for Co-packaged optics
2.2 Quality and reliability issues with co-packaged optics
2.3 Components for co-packaged optics devices
2.3.1 Connectors
2.3.2 Light sources: VCSELs, quantum lasers, etc.
2.3.3 Use of interposer and waveguide technology
2.3.4 Emerging packaging technology
2.3.5 Switching ASIC, chiplets and co-packaged optics
2.3.6 Substrates for co-packaged optics
2.4 Testing co-packaged optics devices and systems
2.5 Key points from this chapter

Chapter Three The Co-Package Collaboration and Other Organizations
3.1 The Co-Packaged Collaboration
3.1.1 Membership and who the Collaboration represents
3.1.2 The future of open specifications for design elements
3.1.3 Messaging to ASIC and switch makers
3.1.4 Implications for the photonics and datacom industries
3.2 OIF, EPIC and other relevant organizations
2.4 Key points from this chapter

Chapter Four Five-year Market Assessment and Five-year Forecast
4.1 Time to market: A co-packaged roadmap
4.2 Market forecasts of co-packaged optics in the data center
4.2.1 400G
4.2.2 800G
4.2.3 Terabit networks
4.3 Market forecasts for co-packaged optics in public networks
4.4 Market forecasts for co-packaged optics in computinh
4.4.1 High-performance computing and supercomputing
4.4.2 Storage systems
4.4.3 AI and machine learning
4.5 Other

Chapter Five: Profiles
5.1 ASE Group
5.2 Broadcom
5.3 Cisco
5.4 Corning
5.5 Facebook
5.6 IBM
5.7 Intel
5.8 Juniper
5.9 Kaiam
5.10 Microsoft
5.11 POET Technologies
5.12 Rain Tree Photonics
5.13 Ranovus
5.14 Rockley Photonics
6.15 Samtec
5.16 Senko
5.17 TE Connectivity
5.18 vario-optics ag
5.19 Rain Tree Photonics