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This research note is based on CIR’s new report, “Revenue Opportunities for Optical Interconnects: Market and Technology Forecast – 2013 to 2020 Vol II: On-Chip and Chip-to-Chip” Over the next five years chip companies will experience an “interconnect bottleneck” that will cause them to create alternatives to current metal/electrical interconnects. The most likely technology direction

When CIR published a report on the optical interconnect market in 2010, the goal of the report at the time was to provide a full analysis of the entire optical interconnect business. In this year’s CIR analysis we are covering the market in two reports, focusing primarily on interconnects in the chip-to-chip and on-chip sector

This research note is based on CIR’s new report, “Revenue Opportunities for Optical Interconnects: Market and Technology Forecast – 2013-2020. Vol. I Board-to-Board and Rack-Based” CIR’s latest forecast for sales of optical interconnection devices used at the rack level and for board-to-board interconnection remains bullish. We are anticipating revenues doubling from $1.1 million to $2.2

CIR last published a report on the optical interconnect market in 2010. The goal of the report at the time was to provide a full analysis of the optical interconnect business, which was taken to include: • Optical cable assemblies inside equipment as well as between equipment, or defined as board-to-board and rack-to-rack, respectively; •

Active optical cabling (AOC) is a black-box solution to creating a fiber-optic connection and consists of a complete fiber-optic data link (transceivers plus cable) that can be plugged into existing ports, enabling a very rapid introduction of optical connections. AOCs provide customers with access to all the undisputed advantages of fiber (high bandwidth, relatively thin,