Sales of Co-Packaged Optical Components Will Surpass $1.3 billion (US) by 2025

Charlottesville, Virginia: In a recent from issued by Communications Industry Researchers (CIR), the firm projected that sales of specialized co-packaged optical components will exceed $1.3 billion in revenues in 2025 and grow to $2.7 billion by 2028. CIR’s latest CPO report, “Markets for Co-Packaged Optics 2022-2030” analyzes both component and module-level CPO product developments. Additional details about the report, including an excerpt, can be found at

About the Report

This new CIR report examines the latest developments in connectivity, lasers, and cooling systems for CPO as well as showing how CPO modules will be used in four kinds of data center. The report forecasts CPO from 2022 to 2030 with breakouts by type of data center and location (inter-building/inter-machine or rack/server) in the data center. This report has a strong emphasis on CPO’s impact on the optoelectronic supply chain in the wake of both technological change and geopolitical developments. Key companies discussed include AMD, Anritsu, Ayar Labs, Broadcom, Furukawa Electric, GlobalFoundries, IBM, Marvell, Lumentum, Ranovus, SENKO, TE Connectivity, Xilinx, and others.

CIR is currently focusing its efforts in the areas of short-haul data communications interconnectivity with coverage on CPO, active optical cable, optical chip-to-chip communications, and data center coherent communications.

From the Report

• The commercial potential of co-packaged optical components was recently demonstrated, when Senko Advanced Components acquired Cudoform, specifically for access to Cudoform’s micro-mirror connector in a CPO application. Other CPO components in immediate demand include cooling systems and external lasers. Intel researchers also recently demonstrated an eight-wavelength silicon laser array that Intel believes can be integrated into a CPO package.

• Large deployments of CPO systems may not occur until 2027, but CPO module manufacturers are already buying critical co-packaged optical components; a couple of years in advance. CPO components will be the first big opportunity in the coming CPO revolution.

• Demand for CPO components will spur manufacturing to meet the demanding requirements for tight-spaced packaging and hard-to-integrate photonics. The goal of Intel’s research laser array is specifically a high-volume chiplet-product. Among those increasingly focused on CPO are merchant silicon firms, which are leveraging the latest silicon photonics technology to exploit this opportunity

About CIR
CIR has published hype-free industry analysis for the optical networking and photonics for more than 35 years. Our reports provide informed and reasoned market forecasts and industry analysis to a global roster of clients. In addition, to market analysis reports, CIR provides data sets of optical components with breakouts by types of data center and end user.

Visit for a full listing of CIR’s reports and other services.

Media Contact:

Robert Nolan
(804) 972-1043

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