Networking and Interconnects

This report explores the future of co-packaged optics (CPO) and related technologies as an interconnect technology for AI data centers.    It includes granular forecasts of CPO shipments taking into consideration realistic time frames for the commercial development of CPO.  The forecasts are broken out in various ways including, data rate, standards/technology  location in the network (data center interconnect, intra-rack and inter-rack).  There are also strategic profiles of approximately 30 major influencer firms developing CPO products.  Finally, the report devotes significant space to how end-users will optimally deploy CPO for AI in the next ten years both in the immediate future and how this will change as products and standards change.